厚膜研發(fā)工程師英文簡歷

Resume number:	484991702	Updating date:	2012-10-29 13:34:06	no photo
Name:	Mr. linpeng	Nationality:	China (Mainland)
Current Place:	Zhongshan	Height/Weight:	168 cm?63 kg
Marital Status:	Single	Age:	29 years

Career Objective

Application type:	Jobseeker
Preferred job title:	Others: PM 、 Sales Engineer: 、 Pre-sales/After-sales Technical Support Engineer:
Working life:	5	Title:	Senior title
Job type:	Full time	Expected Start date:	In a week
Expected salary:	￥8,000--￥12,000	Preferred working place:	Guangzhou Shenzhen Zhuhai

Work experience

Company's name: Ambit (Foxconn)Begin and end date: 2004-08-2012-07 Enterprise nature: Soly foreign funded enterprisesIndustry: Communication/Telecom/Network Equipment Job Title: Thick film new product leader Job description: Team leader 1.During 2004~2005,I am mainly responsible for RF new product introduce and success in transferring Freescale’s Yellow into mass production. 2.During 2005~2006,I am mainly responsible for thick-film transfer project and success in transferring the substrate assembly from Taiwan to ZhongShan. 3.During 2005~2012, I am mainly responsible for thick-film new product (Acousticon microphone) introduce and success in transferring several main products into mass production, such as EM, FG, TO series. 4.During 2006~2007, success in replacing dispensing epoxy to printing epoxy and reducing 4/5 work hours. 5.During 2007~2008, success in replacing AT to PT and reducing 4/5 work hours. Six Sigma project 1.2006~2007,improved the circuit PFA yield from 60% to 99%. 2.2007~2008,reduced scrap and improved thick-film product overall yield from 94% to 98%. 3.2008~2012,improved the usage of substrate form 45% to 75%. Reasons for leaving:

Educational Background

Name of School:	Wuhan University of Science and Technology
Highest Degree:	Bachelor	Date of Graduation:	2004-07-01
Name of Major 1:	mechanical engineering and automation	Name of Major 2:
Education experience:	Start date End date Education organization Majors Certificate Certificate No 2000-09 2004-07 Wuhan University of Science and Technology mechanical engineering and automation bachelor 1048840401118

Language Ability

Foreign Language:	English	Level:	good
Chinese level:	normal	Cantonese Level:	normal

Relevant skills and abilities

After graduating I work for Ambit (Foxconn), the current job is the thick film department of new product project leader, responsible for a major new product process as follows: Circuit Assembly (wafer dicing, flip chip, reflow, dispensing, testing, Circuit sawing), Substrate Assembly (printing, firing, resistor laser trim, testing). 5-years thick film product development, integrated circuit chip package assembly work experience, familiar with the RF package production process. Particularly in the following jobs has accumulated a wealth of practical experience: 1.Be familiar with substrate printing screen/stencil design and modification. 2.Be skilled in evaluation and selection of substrate assembly (conductor/resistor/dielectric paste, ceramic substrate, and clean solvent) and circuit assembly (solder paste, flux, under hill, blade, and clean solvent). 3.Be skilled in customer drawing review and modification, gap analyzes report provided. 4.Be good at planning new projects, gathering resources and coordination, setting up BOMs, product pricing, tooling design, introduction into mass production and relevant system documents like MFG, SOP, etc. 5.Be good at DOE to carry out experimental design and using Minitab to analyze the experiment. 6.Be good at SPC system, like7QC, FMEA, Control plan and Control MSA. 7.Deeply understand team management and process improvement, like TQM and cost down. 8.Proficient in Office tools, such as Excel, Word, PowerPoint, Notes, etc. 9.Proficient in Auto CAD, CAM350 and GC-GAM. Be capable to analyze and improve the structure and function of products by using these engineering applications.

Self-recommendation letter

Five years experienced in new product introduce and project management in a world-class corporation. Be positive, creative and willing to work as a team. Have strong independent problem-solving and communication skills, and be capable to help customers to solve the problem quickly to meet customer requirements. Hope to make full use of 5 years in the semiconductor company development of new products, and customer coordination and communication experience for your company.

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